Signaling in 3-D integrated circuits, benefits and challenges

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuits provide a potent approach to enhance the performance and integrate diverse functions within amulti-plane stack. Clock networks consume a great portion of the power dissipated in a circuit. Therefore, designing a low-power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Synchronization issues can be more challenging for 3-D circuits since a clock path can spread across several planes with different physical and electrical characteristics. Consequently, designing low power clock networks for 3-D circuits is an important issue. Resonant clock networks are considered efficient low-power alternatives to conventional clock distribution schemes. These networks utilize additional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. In this research, a design method to apply resonant clocking to synthesized clock trees is proposed. Manufacturing processes for 3-D circuits include some additional steps as compared to standard CMOS processes which makes 3-D circuits more susceptible to manufacturing defects and lowers the overall yield of the bonded 3-D stack. Testing is another complicated task for 3-D ICs, where pre-bond test is a prerequisite. Pre-bond testability, in turn, presents new challenges to 3-D clock network design primarily due to the incomplete clock distribution networks prior to the bonding of the planes. A design methodology of resonant 3-D clock networks that support wireless pre-bond testing is introduced. To efficiently address this issue, inductive links are exploited to wirelessly transmit the clock signal to the disjoint resonant clock networks. The inductors comprising the LC tanks are used as the receiver circuit for the links, essentially eliminating the need for additional circuits and/or interconnect resources during pre-bond test. Recent FPGAs are quite complex circuits which provide reconfigurablity at the cost of lower performance and higher power consumption as compared to ASIC circuits. Exploiting a large number of programmable switches, routing structures are mainly responsible for performance degradation in FPAGs. Employing 3-D technology can providemore efficient switches which drastically improve the performance and reduce the power consumption of the FPGA. RRAM switches are one of the most promising candidates to improve the FPGA routing architecture thanks to their low on-resistance and non-volatility. Along with the configurable switches, buffers are the other important element of the FPGAs routing structure. Different characteristics of RRAM switches change the properties of signal paths in RRAM-based FPGAs. The on resistance of RRAMswitches is considerably lower than CMOS pass gate switches which results in lower RC delay for RRAM-based routing paths. This different nature in critical path and signal delay in turn affect the need for intermediate buffers. Thus the buffer allocation should be reconsidered. In the last part of this research, the effect of intermediate buffers on signal propagation delay is studied and a modified buffer allocation scheme for RRAM-based FPGA routing path is proposed

Parallel vs. Serial Inter-plane communication using TSVs

3-D integration is a promising prospect for implementing high performance multifunctional systems-on- chip. Through Silicon Vias (TSVs) are the enablers for achieving high bandwidth paths in inter-plane communications. TSVs also provide higher vertical link density and facilitate the heat flow in the 3-D circuits as compared to other potential schemes such as inductive links. However, reliability issues and crosstalk problems among adjacent TSVs decrease the yield and performance of TSV based circuits. Reducing the number of TSVs employed for inter-plane signal transferring can alleviate these problems. This paper proposes to exploit serialization to reduce the number of TSVs in a 3D circuit and presents a comparison between different aspects of TSV-based 3-D circuits such as area, power, crosstalk and yield in parallel and serial vertical links

Low-power clock distribution networks for 3-D ICs

Designing a low power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Resonant clock networks are considered efficient low-power alternatives to conventional clock distribution schemes. These networks utilize additional inductive circuits to reduce the power consumption while delivering a full swing clock signal to the sink nodes. Test is another complex task for 3-D ICs, where pre-bond test is a prerequisite. This paper, consequently, introduces a design methodology for resonant 3-D clock networks that lowers the power of the clock networks while supporting pre-bond test. Several 3-D clock network topologies are explored in a 0.18 μm CMOS technology. Simulation results indicate 43% reduction in the power consumed by the resonant 3-D clock network as compared to a conventional buffered clock network. By properly distributing the inductance within the layers of the 3-D stack, resonance is ensured both in pre-bond test and normal operation. The important aspects of this approach are introduced in this paper

A Low-Overhead Method for Pre-bond Test of Resonant 3-D Clock Distribution Networks

Designing a low power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Resonant clock networks are considered efficient low power alternatives to con- ventional clock distribution schemes. These networks utilize ad- ditional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. Test is another complex task for 3-D ICs, where pre-bond test is a prerequisite. Contactless test has been considered as an alternative for conventional test methods. This paper, consequently, introduces a design method- ology for resonant 3-D clock networks that supports wireless pre- bond testing through the use of inductive links. By employing the inductors comprising the LC tanks of the resonant clock net- works as the receiver circuit for the links, the need for additional circuits and/or interconnect resources during pre-bond test is essentially eliminated. The proposed technique produces low power and pre-bond testable 3-D clock distribution networks. Simulation results indicate 98.5% and 99% decrease in the area overhead and power consumed by the contactless testing method as compared to existing methods

A Study on Buffer Distribution for RRAM-based FPGA Routing Structures

Compared to Application-Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs) provide reconfigurablity at the cost of lower performance and higher power consumption. Exploiting a large number of programmable switches, routing structures are mainly responsible for the performance limitation. Hence, employing more efficient switches can drastically improve the performance and reduce the power consumption of the FPGA. Resistive Random Access Memory (RRAM)-based switches are one of the most promising candidates to improve the FPGA routing architecture thanks to their low on-resistance and non-volatility. The lower RC delay of RRAM-based routing multiplexers, as compared to CMOS-based routing structures encourages us to reconsider the buffer distribution in FPGAs. This paper proposes an approach to reduce the number of buffers in the routing path of RRAM-based FPGAs. Our architectural simulations show that the use of RRAM switches improves the critical path delay by 56% as compared to CMOS switches in standard FPGA circuits at 45-nm technology node while, at the same time, the area and power are reduced, respectively, by 17% and 9%. By adapting the buffering scheme, an extra bonus of 9% for delay reduction, 5% for power reduction and 16% for area reduction can be obtained, as compared to the conventional buffering approach for RRAM-based FPGAs

A Ultra-Low-Power FPGA Based on Monolithically Integrated RRAMs (invited)

Field Programmable Gate Arrays (FPGAs) rely heavily on complex routing architectures. The routing structures use programmable switches and account for a significant share in the total area, delay and power consumption numbers. With the ability of being monolithically integrated with CMOS chips, Resistive Random Access Memories (RRAMs) enable high-performance routing architectures through the replacement of Static Random Access Memory (SRAM)-based programming switches. Exploiting the very low on-resistance state achievable by RRAMs as well as the improved tolerance to power supply reduction, RRAM-based routing multiplexers can be used to significantly reduce the power consumption of FPGA systems with no performance compromises. By evaluating the opportunities of ultra-low-power RRAM-based FPGAs at the system level, we see an improvement of 12%, 26% and 81% in area, delay and power consumption at a mature technology node

Inter-plane communication methods for 3-D ICs

Three-dimensional (3-D) integration is an emerging candidate for implementing high performance multifunctional systems-on-chip. Employing an efficient medium for data communication among different planes is a key factor in achieving a high performance 3-D system. Through Silicon Vias (TSVs) provide high bandwidth, high density inter-plane links while facilitating the flow of heat in 3-D circuits. This paper provides an overview of the diverse applications of TSVs within 3-D circuits and surveys the manufacturing and design challenges relating to these interconnects. Inter-plane communication through AC-coupled on-chip inductors is also discussed as an alternative to TSVs. Although there have been several efforts that model the electrical characteristics of these inter-plane communication schemes, the effect that heat can have on the performance of the inter-plane link implemented with either means has not sufficiently been investigated. Consequently, some insight on the effects of thermal gradients on the performance of these links is offered. Results indicate that the electrical performance of TSV is not susceptible to temperature variations. Signal integrity can, however, be degraded in the case of pronounced thermal gradients in contactless 3-D ICs, as demonstrated by a decay of the S-parameters for the investigated inductive links

An Enhanced Design Methodology for Resonant Clock Trees

Clock distribution networks consume a considerable portion of the power dissipated by synchronous circuits. In conventional clock distribution networks, clock buffers are inserted to retain signal integrity along the long interconnects, which, in turn, significantly increase the power consumed by the clock distribution network. Resonant clock distribution networks are considered as efficient low-power alternatives to traditional clock distribution schemes. These networks utilize additional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. A design method for applying the resonant clocking approach for synthesized clock trees is presented. The proper number and placement of LC tanks and the related resonance parameters are determined in the proposed method. This method attempts to minimize the number of LC tanks that can deliver a full swing signal to all the sink nodes by considering the capacitive load at each node to determine the location of LC tanks. Resonance parameters, such as the size of the inductor can be adapted to reduce the power consumption and/or area overhead of the clock distribution network. Simulation results indicate up to 57% reduction in the power consumed by the resonant clock network as compared to a conventional buffered clock network. Compared to existing methods, the number of LC tanks for the proposed technique is decreased up to 15% and the signal swing is also improved by 44%. Depending on whether power or area is the design objective, two different approaches are followed to determine the parameters of resonance. If the design objective is to lower the power consumed by the network, the power and area of the designed network improve up to 24% and 51%, respectively, as compared to state of the art methods. If a low area is targeted, the power and area improvements are 11% and 57%, respectively